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BTA312X-800C Datenblatt(PDF) 5 Page - NXP Semiconductors

Teilenummer BTA312X-800C
Bauteilbeschribung  12 A Three-quadrant triacs high commutation
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Direct Link  http://www.nxp.com
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BTA312X_SER_B_C_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 17 December 2007
5 of 12
NXP Semiconductors
BTA312X series B and C
12 A Three-quadrant triacs high commutation
5.
Thermal characteristics
6.
Isolation characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-h)
thermal resistance from junction to
heatsink
full or half cycle; without
heatsink compound; see
Figure 6
-
-
5.5
K/W
full or half cycle; with
heatsink compound; see
Figure 6
-
-
4.0
K/W
Rth(j-a)
thermal resistance from junction to
ambient
in free air
-
55
-
K/W
(1) Unidirectional (half cycle) without heatsink compound
(2) Unidirectional (half cycle) with heatsink compound
(3) Bidirectional (full cycle) without heatsink compound
(4) Bidirectional (full cycle) with heatsink compound
Fig 6.
Transient thermal impedance from junction to heatsink as a function of pulse duration
003aab672
10−1
10−2
1
10
Zth(j-h)
(K/W)
10−3
tp (s)
10−5
110
10−1
10−2
10−4
10−3
tp
P
t
(1)
(2)
(3)
(4)
Table 5.
Isolation limiting values and characteristics
Th = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Visol(RMS)
RMS isolation voltage
from all three terminals to
external heatsink; f = 50 Hz to
60 Hz; sinusoidal waveform;
RH
≤ 65 %; clean and dust free
-
-
2500
V
Cisol
isolation capacitance
from pin 2 to external heatsink;
f=1MHz
-10
-
pF


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