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ADM1062ACPZ-REEL7 Datenblatt(PDF) 8 Page - Analog Devices

Teilenummer ADM1062ACPZ-REEL7
Bauteilbeschribung  Super Sequencer with Margining Control and Temperature Monitoring
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ADM1062ACPZ-REEL7 Datenblatt(HTML) 8 Page - Analog Devices

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ADM1062
Rev. C | Page 8 of 36
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Voltage on VH Pin
16 V
Voltage on VPx Pins
7 V
Voltage on VXx Pins
−0.3 V to +6.5 V
Voltage on A0, A1 Pins
−0.3 V to +7 V
Voltage on REFIN, REFOUT Pins
5 V
Voltage on VDDCAP, VCCP Pins
6.5 V
Voltage on PDOx Pins
16 V
Voltage on SDA, SCL Pins
7 V
Voltage on GND, AGND, PDOGND,
REFGND Pins
−0.3 V to +0.3 V
Voltage on DN, DP Pins
−0.3 V to +5 V
Input Current at Any Pin
±5 mA
Package Input Current
±20 mA
Maximum Junction Temperature (TJ max)
150°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature,
Soldering Vapor Phase, 60 sec
215°C
ESD Rating, All Pins
2000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
Unit
40-Lead LFCSP
25
°C/W
48-Lead TQFP
50
°C/W
ESD CAUTION


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