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TS68882MF20 Datenblatt(PDF) 8 Page - ATMEL Corporation

Teilenummer TS68882MF20
Bauteilbeschribung  CMOS Enhanced Floating-point Co-processor
Download  43 Pages
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Hersteller  ATMEL [ATMEL Corporation]
Direct Link  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

TS68882MF20 Datenblatt(HTML) 8 Page - ATMEL Corporation

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TS68882
2119A–HIREL–04/02
Thermal
Characteristics
Power
Considerations
The average chip-junction temperature, TJ, in °C can be obtained from:
TJ =TA +(PD + θJA)(1)
TA = Ambient Temperature, °C
θ
JA = Package Thermal Resistance, Junction-to-Ambient, °C/W
PD =PINT +PI/O
PINT =ICC xVCC, Watts - Chip Internal Power
PI/O = Power Dissipation on Input and Output Pins - User Determined
For most applications PI/O <PINT and can be neglected.
An Approximate relationship between PD and TJ (if PI/O is neglected) is:
PD =K: (TJ + 273)
(2)
Solving equations (1) and (2) for K gives
K= PD.(TA +273) + θJA · PD
2
(3)
where K is constant pertaining to the particular part K can be determined from the equa-
tion (3) by measuring PD (at equilibrium) for a known TA.Using this value ofK,the
values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any
value of TA.
The total thermal resistance of a package (
θ
JA) can be separated into two components,
θ
JC and θCA, representing the barrier to heat flow from the semiconductor junction to the
package (case), surface (
θ
JC) and from the case to the outside ambient (θCA). These
terms are related by the equation:
θ
JA = θJC + θCA
(4)
θ
JA is device related and cannot be influenced by the user. However, θCA is user depen-
dent and can be minimized by such thermal management techniques as heat sinks,
ambient air cooling and thermal convection. Thus, good thermal management on the
part of the user can significantly reduce
θ
CA so that θJA approximately equals θJC. Substi-
tution of
θ
JC for θJA in equa tio n (1 ) wil l result i n a l ower semi co nductor j uncti on
temperature.
Table 4.
Package
Symbol
Parameter
Value
Rating
PGA 68
θ
JA
Thermal Resistance - Ceramic Junction To Ambient
33
°C/W
θ
JC
Thermal Resistance - Ceramic Junction To Case
4
°C/W
CQFP
θ
JA
Thermal Resistance - Ceramic Junction To Ambient
33
°C/W
θ
JC
Thermal Resistance - Ceramic Junction To Case
3
°C/W


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