1

NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

Memory Back-Up Capacitors

NEXG Series

NIC P/N

Capacitance Value (F)

Charge Discharge

Holding Volt-

age (VDC min.)

Max. Current @

30 minutes (mA)

Max. ESR @

1KHz (

Ω)

Typical DCR

(

Ω)

NEXG103Z5.5V11X5.5F

0.01

0.013

4.2

0.015

300

94

NEXG223Z5.5V11X5.5F

0.022

0.028

4.2

0.033

200

31

NEXG473Z5.5V11X5.5F

0.047

0.060

4.2

0.071

200

29

NEXG104Z5.5V11X6.5F

0.10

0.13

4.2

0.15

100

16

NEXG224Z5.5V13X9F

0.22

0.28

4.2

0.33

100

15

NEXG474Z5.5V14.5X18F

0.47

0.60

4.2

0.71

120

26

NEXG105Z5.5V16.5X19F

1.0

1.3

4.2

1.5

65

14

NEXG225Z5.5V21.5X19F

2.2

2.8

4.2

3.3

35

7

NEXG475Z5.5V28.5X22F

4.7

6.0

4.2

7.1

35

3.2

Rated Voltage Range

5.5VDC

Rated Capacitance Range

0.01F ~ 4.7F (10,000

μF ~ 4,700,000μF)

Operating Temp. Range

-25°C ~ +70°C

Capacitance Tolerance

+80%/-20% (Z)

Load Life Test @ 70°C

1,000 hours

Δ Capacitance Change

Less than ±30% of initial measured value

Maximum ESR

Less than 200% of the specified maximum value

Current at 30 minutes

Less than 200% of the specified maximum value

Temperature Cycling

(5 cycles, -25 ~ +70°C

Δ Capacitance Change

Within +80%/-20% of specified value

Maximum ESR

Less than specified maximum value

Current at 30 minutes

Less than specified maximum value

Humidity Resistance

(240 hours @ 40°C/90% RH)

Δ Capacitance Change

Less than ±20% of initial measured value

Maximum ESR

Less than 120% of the specified maximum value

Current at 30 minutes

Less than 120% of the specified maximum value

NIC P/N

DIMENSIONS (mm)

DH

S

LL

NEXG103Z5.5V11X5.5F

11.0

5.5

5.08

2.7

0.2

1.2

NEXG223Z5.5V11X5.5F

11.0

5.5

5.08

2.7

0.2

1.2

NEXG473Z5.5V11X5.5F

11.0

5.5

5.08

2.7

0.2

1.2

NEXG104Z5.5V11X6.5F

11.0

6.5

5.08

2.7

0.2

1.2

NEXG224Z5.5V13X9F

13.0

9.0

5.08

2.2

0.4

1.2

NEXG474Z5.5V14.5X18F

14.5

18.0

5.08

2.4

0.4

1.2

NEXG105Z5.5V16.5X19F

16.5

19.0

5.08

2.7

0.4

1.2

NEXG225Z5.5V21.5X19F

21.5

19.0

7.62

3.0

0.6

1.2

NEXG475Z5.5V28.5X22F

28.5

22.0

10.16

6.1

0.6

1.4

FEATURES

• DOUBLE LAYER CONSTRUCTION

• HIGH CURRENT DISCHARGE (UP TO 500

μA)

• IDEAL FOR LONG TIME BACK-UP POWER SUPPLY

• SUITABLE FOR FLOW SOLDERING

• LEAD-FREE FINISH

CASE DIMENSIONS (mm)

STANDARD VALUES AND SPECIFICATIONS

CHARACTERISTICS

*See Part Number System for Details

RoHS

Compliant

includes all homogeneous materials

Super Capacitor

Super Capacitor

Application Guide

Application Guide

PRECAUTIONS

WASHING is NOT RECOMMENDED. Additional guidelines and precautions

can be found at www.niccomp.com/precautions

If in doubt or uncertainty, please review your specific application - process details with

NIC’s technical support personnel: tpmg@niccomp.com

TERMINATION FINISH:

Pb-FREE (99%Sn/1%Cu)

+

-

H max.

S ±0.5

D ±0.5

LL min.

0.3mm m

in.

+

-