Datenblatt-Suchmaschine für elektronische Bauteile |
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SM4T26AY Datenblatt(PDF) 5 Page - STMicroelectronics |
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SM4T26AY Datenblatt(HTML) 5 Page - STMicroelectronics |
5 / 12 page SM4TY Characteristics Doc ID 17862 Rev 3 5/12 Figure 11. Peak forward voltage drop versus peak forward current (typical values) Figure 9. Thermal resistance junction to ambient versus copper surface under each lead Figure 10. Leakage current versus junction temperature (typical values) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S (cm²) Cu Printed circuit board FR4, copper thickness = 35 µm 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 25 50 75 100 125 150 I (nA) R T (°C) j V= V V10 V RRM RM ≥ V= V V < 10 V RRM RM 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 T = 125 °C j I (A) FM T = 25 °C j V (V) FM |
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