Datenblatt-Suchmaschine für elektronische Bauteile |
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LM25088 Datenblatt(PDF) 3 Page - Texas Instruments |
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LM25088 Datenblatt(HTML) 3 Page - Texas Instruments |
3 / 33 page LM25088 www.ti.com SNVS609G – DECEMBER 2008 – REVISED MARCH 2011 PIN DESCRIPTIONS (continued) Pin(S) Name Description Application Information 10 RES Hiccup Mode Restart ( The RES pin is normally connected to an external capacitor that sets the timing LM25088-2 Only) for hiccup mode current limiting. In normal operation, a 25 µA current source discharges the RES pin capacitor to ground. If cycle-by-cycle current limit threshold is exceeded during any PWM cycle, the current sink is disabled and RES capacitor is charged by an internal 50 µA current. If the RES voltage reaches 1.2V, the HG pin gate drive signal will be disabled and the RES pin capacitor will be discharged by a 1 µA current sink. Normal operation will resume when the RES pin falls below 0.2V. 11 CSG Current Sense Ground Low side reference for the current sense resistor. 12 CS Current sense Current measurement connection for the re-circulating diode. An external sense resistor and an internal sample/hold circuit sense the diode current at the conclusion of the buck switch off-time. This current measurement provides the DC offset level for the emulated current ramp. 13 SW Switching node Connect to the source terminal of the external MOSFET switch. 14 HG High Gate Connect to the gate terminal of the external MOSFET switch. 15 BOOT Input for bootstrap capacitor An external capacitor is required between the BOOT and the SW pins to provide bias to the MOSFET gate driver. The capacitor is charged from VCC via an internal diode during the off-time of the buck switch. 16 VCC Output of the bias regulator VCC tracks VIN up to the regulation level (7.8V Typ). A 0.1 µF to 10 µF ceramic decoupling capacitor is required. An external voltage between 8.3V and 13V can be applied to this pin to reduce internal power dissipation. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) VIN, VOUT to GND 45V BOOT to GND 60V SW to GND -2V to 45V VCC to GND -0.3V to 16V HG to SW -0.3V to BOOT+0.3V EN to GND 14V BOOT to SW -0.3V to 16V CS, CSG to GND -0.3V to 0.3V All other inputs to GND -0.3V to 7V ESD Rating Human Body Model(4) 2 kV Storage Temperature Range −65°C to + 150°C Junction Temperature + 150°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) For detailed information on soldering plastic VSSOP packages refer to the Packaging Data Book (SNOA549) available from TI. (4) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. Operating Ratings (1) VIN Voltage 4.5V to 42V VCC Voltage (externally supplied) 8.3V to 13V Operation Junction Temperature −40°C to + 125°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics. Copyright © 2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM25088 |
Ähnliche Teilenummer - LM25088_14 |
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Ähnliche Beschreibung - LM25088_14 |
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