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LM25088 Datenblatt(PDF) 3 Page - Texas Instruments

Teilenummer LM25088
Bauteilbeschribung  Wide Input Range Non-Synchronous Buck Controller
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LM25088
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SNVS609G – DECEMBER 2008 – REVISED MARCH 2011
PIN DESCRIPTIONS (continued)
Pin(S)
Name
Description
Application Information
10
RES
Hiccup Mode Restart (
The RES pin is normally connected to an external capacitor that sets the timing
LM25088-2 Only)
for hiccup mode current limiting. In normal operation, a 25 µA current source
discharges the RES pin capacitor to ground. If cycle-by-cycle current limit
threshold is exceeded during any PWM cycle, the current sink is disabled and
RES capacitor is charged by an internal 50 µA current. If the RES voltage
reaches 1.2V, the HG pin gate drive signal will be disabled and the RES pin
capacitor will be discharged by a 1 µA current sink. Normal operation will resume
when the RES pin falls below 0.2V.
11
CSG
Current Sense Ground
Low side reference for the current sense resistor.
12
CS
Current sense
Current measurement connection for the re-circulating diode. An external sense
resistor and an internal sample/hold circuit sense the diode current at the
conclusion of the buck switch off-time. This current measurement provides the
DC offset level for the emulated current ramp.
13
SW
Switching node
Connect to the source terminal of the external MOSFET switch.
14
HG
High Gate
Connect to the gate terminal of the external MOSFET switch.
15
BOOT
Input for bootstrap capacitor
An external capacitor is required between the BOOT and the SW pins to provide
bias to the MOSFET gate driver. The capacitor is charged from VCC via an
internal diode during the off-time of the buck switch.
16
VCC
Output of the bias regulator
VCC tracks VIN up to the regulation level (7.8V Typ). A 0.1 µF to 10 µF ceramic
decoupling capacitor is required. An external voltage between 8.3V and 13V can
be applied to this pin to reduce internal power dissipation.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2) (3)
VIN, VOUT to GND
45V
BOOT to GND
60V
SW to GND
-2V to 45V
VCC to GND
-0.3V to 16V
HG to SW
-0.3V to BOOT+0.3V
EN to GND
14V
BOOT to SW
-0.3V to 16V
CS, CSG to GND
-0.3V to 0.3V
All other inputs to GND
-0.3V to 7V
ESD Rating
Human Body Model(4)
2 kV
Storage Temperature Range
−65°C to + 150°C
Junction Temperature
+ 150°C
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
For detailed information on soldering plastic VSSOP packages refer to the Packaging Data Book (SNOA549) available from TI.
(4)
The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin.
Operating Ratings
(1)
VIN Voltage
4.5V to 42V
VCC Voltage (externally supplied)
8.3V to 13V
Operation Junction Temperature
−40°C to + 125°C
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
Copyright © 2008–2011, Texas Instruments Incorporated
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