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SM30T23AYCAY Datenblatt(PDF) 9 Page - STMicroelectronics |
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SM30T23AYCAY Datenblatt(HTML) 9 Page - STMicroelectronics |
9 / 12 page DocID022065 Rev 3 9/12 SM30TY Package information 12 3 Package information • Case: JEDEC DO-214AB molded plastic over planar junction • Terminals: solder plated, solderable as per MIL-STD-750, Method 2026 • Polarity: for unidirectional types the band indicates cathode • Flammability: epoxy is rated UL 94, V0 • RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 16. IPAK dimension definitions Table 3. SMC dimension values Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.20 0.114 0.126 c 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 E C L E2 E1 D A1 A2 b |
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