Datenblatt-Suchmaschine für elektronische Bauteile |
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CD40104BMS Datenblatt(PDF) 10 Page - Intersil Corporation |
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CD40104BMS Datenblatt(HTML) 10 Page - Intersil Corporation |
10 / 10 page 7-1316 CD40104BMS, CD40194BMS FIGURE 9. TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY Chip Dimensions and Pad Layouts CD40104BMS CD40194BMS Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches Typical Performance Characteristics (Continued) FREQUENCY (f φ) (kHz) 8 6 4 2 105 8 6 4 2 104 8 6 4 2 103 8 6 4 2 102 10 0.1 8 6 4 2 1 8 6 4 2 10 102 103 104 8 6 4 28 6 4 28 6 4 2 AMBIENT TEMPERATURE (TA) = +25 oC SUPPLY VOLTAGE (VDD) = 5V 10V 15V CL = 50pF CL = 15pF |
Ähnliche Teilenummer - CD40104BMS |
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Ähnliche Beschreibung - CD40104BMS |
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