7-1316

CD40104BMS, CD40194BMS

FIGURE 9. TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY

Chip Dimensions and Pad Layouts

CD40104BMS

CD40194BMS

Dimensions in parenthesis are in millimeters and are

derived from the basic inch dimensions as indicated.

METALLIZATION:

Thickness: 11k

Å

PASSIVATION:

10.4kÅ - 15.6k

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches

FREQUENCY (f

φ) (kHz)

8

6

4

2

8

6

4

2

8

6

4

2

8

6

4

2

10

0.1

8

6

4

2

1

8

6

4

2

10

8

6

4

28

6

4

28

6

4

2

SUPPLY VOLTAGE (VDD) = 5V

10V

15V

CL = 50pF

CL = 15pF