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CD4023 Datenblatt(PDF) 6 Page - Intersil Corporation

Teilenummer CD4023
Bauteilbeschribung  CMOS NAND Gates
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Hersteller  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

CD4023 Datenblatt(HTML) 6 Page - Intersil Corporation

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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Specifications CD4011BMS, CD4012BMS, CD4023BMS
Group B
Subgroup B-5
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6
Sample 5005
1, 7, 9
Group D
Sample 5005
1, 2, 3, 8A, 8B, 9
Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE GROUPS
MIL-STD-883
METHOD
TEST
READ AND RECORD
PRE-IRRAD
POST-IRRAD
PRE-IRRAD
POST-IRRAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
1, 9
Table 4
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
FUNCTION
OPEN
GROUND
VDD
9V
± -0.5V
OSCILLATOR
50kHz
25kHz
PART NUMBER CD4011B
Static Burn-In
1 Note 1
3, 4, 10, 11
1, 2, 5 - 9, 12, 13
14
Static Burn-In
2 Note 1
3, 4, 10, 11
7
1, 2, 5, 6, 8, 9,
12 - 14
Dynamic Burn-
In Note 1
-
7
14
3, 4, 10, 11
1, 2, 5, 6, 8, 9, 12,
13
Irradiation
Note 2
3, 4, 10, 11
7
1, 2, 5, 6, 8, 9,
12 - 14
PART NUMBER CD4012B
Static Burn-In
1 Note 1
1, 6, 8, 13
2 - 5, 7, 9 - 12
14
Static Burn-In
2 Note 1
1, 6, 8, 13
7
2 - 5, 9 - 12, 14
Dynamic Burn-
In Note 1
6, 8
7
14
1, 13
2 - 5, 9 - 12
Irradiation
Note 2
1, 6, 8, 13
7
2 - 5, 9 - 12, 14
PART NUMBER CD4023B
Static Burn-In
1 Note 1
6, 9, 10
1 - 5, 7, 8, 11 - 13
14
Static Burn-In
2 Note 1
6, 9, 10
7
1 - 5, 8, 11 - 14
Dynamic Burn-
In Note 1
-
7
14
6, 9, 10
1 - 5, 8, 11 - 13
Irradiation
Note 2
6, 9, 10
7
1 - 5, 8, 11 - 14
NOTE:
1. Each pin except VDD and GND will have a series resistor of 10K
± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K
± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures, VDD
= 10V
± 0.5V
TABLE 6. APPLICABLE SUBGROUPS
(Continued)
CONFORMANCE GROUP
MIL-STD-883
METHOD
GROUP A SUBGROUPS
READ AND RECORD


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