Datenblatt-Suchmaschine für elektronische Bauteile |
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CD4019BMS Datenblatt(PDF) 9 Page - Intersil Corporation |
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CD4019BMS Datenblatt(HTML) 9 Page - Intersil Corporation |
9 / 9 page 7-315 CD4019BMS Typical Applications (Continued) Chip Dimensions and Pad Layout FIGURE 12. AND/OR EXCLUSIVE-OR SELECTOR TRUTH TABLE K ( • ) K ( ⊕ ) OUT 00 0 10 A • B 01 A ⊕ B 1 1 A + B A1 ⊕ B1 A1 • B1 A2 ⊕ B2 A2 • B2 A3 ⊕ B3 A3 •B3 A4 ⊕ B4 A4 • B4 CD4001B OR EQUIV CD4001B OR EQUIV CD4001B OR EQUIV CD4001B OR EQUIV A1 B1 A2 B2 A3 B3 A4 B4 CD4001B OR EQUIV CD4019B OUT1 OUT2 OUT3 OUT4 K ( •) K ( ⊕) Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch) METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches |
Ähnliche Teilenummer - CD4019BMS |
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Ähnliche Beschreibung - CD4019BMS |
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