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CD4504BMS Datenblatt(PDF) 8 Page - Intersil Corporation

Teilenummer CD4504BMS
Bauteilbeschribung  CMOS Hex Voltage Level Shifter for TTL-to-CMOS or CMOS-to-CMOS Operation
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Hersteller  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

CD4504BMS Datenblatt(HTML) 8 Page - Intersil Corporation

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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
CD4504BMS
FIGURE 7. HIGH LEVEL SUPPLY VOLTAGE vs LOW LEVEL SUPPLY VOLTAGE
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION:
Thickness: 11k
Å
− 14kÅ, AL.
PASSIVATION:
10.4kÅ - 15.6k
Å, Silane
BOND PADS:
0.004 inches X 0.004 inches MIN
DIE THICKNESS:
0.0198 inches - 0.0218 inches
Typical Performance Characteristics (Continued)
25
20
15
10
5
0
5
10
15
20
25
SUPPLY VOLTAGE (VCC) (V)
AMBIENT TEMPERATURE
(TA) = +25
oC
RECOMMENDED
OPERATING
CONDITIONS
CMOS MODE =
TTL MODE =


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