Datenblatt-Suchmaschine für elektronische Bauteile |
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MTB09P04DJ3 Datenblatt(PDF) 9 Page - Cystech Electonics Corp. |
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MTB09P04DJ3 Datenblatt(HTML) 9 Page - Cystech Electonics Corp. |
9 / 9 page CYStech Electronics Corp. Issued Date : 2014.12.25 Revised Date : 2014.12.26 Page No. : 9/9 Spec. No. : C877J3 MTB09P04DJ3 CYStek Product Specification TO-252 Dimension Inches Marking: Device Name Date Code B09 P04D □□□□ 1 2 3 4 Style: Pin 1.Gate 2.Drain 3.Source 4.Drain 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 Millimeters Inches Millimeters DIM Min. Max. Min. Max. DIM Min. Max. Min. Max. A 0.087 0.094 2.200 2.400 e 0.086 0.094 2.186 2.386 A1 0.000 0.005 0.000 0.127 e1 0.172 0.188 4.372 4.772 B 0.039 0.048 0.990 1.210 H 0.163 REF 4.140 REF b 0.026 0.034 0.660 0.860 K 0.190 REF 4.830 REF b1 0.026 0.034 0.660 0.860 L 0.386 0.409 9.800 10.400 C 0.018 0.023 0.460 0.580 L1 0.114 REF 2.900 REF C1 0.018 0.023 0.460 0.580 L2 0.055 0.067 1.400 1.700 D 0.256 0.264 6.500 6.700 L3 0.024 0.039 0.600 1.000 D1 0.201 0.215 5.100 5.460 P 0.026 REF 0.650 REF E 0.236 0.244 6.000 6.200 V 0.211 REF 5.350 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead : Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. |
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