Datenblatt-Suchmaschine für elektronische Bauteile |
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MTB110P10F3 Datenblatt(PDF) 9 Page - Cystech Electonics Corp. |
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MTB110P10F3 Datenblatt(HTML) 9 Page - Cystech Electonics Corp. |
9 / 9 page CYStech Electronics Corp. Spec. No. : C968F3 Issued Date : 2014.08.05 Revised Date : Page No. : 9/9 MTB110P10F3 CYStek Product Specification TO-263 Dimension *:Typical DIM Inches Millimeters DIM Inches Millimeters Min. Max. Min. Max. Min. Max. Min. Max. A 0.3800 0.4050 9.65 10.29 I 0.0500 0.0700 1.27 1.78 B 0.3300 0.3700 8.38 9.40 J - *0.1000 - *2.54 C - 0.0550 - 1.40 K 0.0450 0.0550 1.14 1.40 D 0.5750 0.6250 14.61 15.88 L 0.0200 0.0390 0.51 0.99 E 0.1600 0.1900 4.06 4.83 1 - - 6 8 F 0.0450 0.0550 1.14 1.40 2 - - 6 8 G 0.0900 0.1100 2.29 2.79 3 - - 0 5 H 0.0180 0.0290 0.46 0.74 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : Lead : Pure tin plated. Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. A B C D 1 2 3 K L J G H F E 2 1 2 3 I Style : Pin 1.Gate 2.Drain 3.Source 3-Lead Plastic Surface Mounted Package CYStek Package Code : F3 Marking : B110 P10 □□□□ Device Name Date Code |
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