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IRF1310NS Datenblatt(PDF) 1 Page - Kersemi Electronic Co., Ltd.

Teilenummer IRF1310NS
Bauteilbeschribung  Fully Avalanche Rated
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Hersteller  KERSEMI [Kersemi Electronic Co., Ltd.]
Direct Link  http://www.kersemi.com
Logo KERSEMI - Kersemi Electronic Co., Ltd.

IRF1310NS Datenblatt(HTML) 1 Page - Kersemi Electronic Co., Ltd.

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IRF1310NS/L
l Advanced Process Technology
l Surface Mount (IRF1310NS)
l Low-profile through-hole (IRF1310NL)
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
Absolute Maximum Ratings
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D2Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF1310NL) is available for low-
profile applications.
Description
VDSS =100V
RDS(on) = 0.036Ω
ID = 42A
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
–––
0.95
RθJA
Junction-to-Ambient ( PCB Mounted,steady-state)**
–––
40
Thermal Resistance
°C/W
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V…
42
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V…
30
A
IDM
Pulsed Drain Current
…
140
PD @TA = 25°C
Power Dissipation
3.8
W
PD @TC = 25°C
Power Dissipation
160
W
Linear Derating Factor
1.1
W/°C
VGS
Gate-to-Source Voltage
± 20
V
EAS
Single Pulse Avalanche Energy
‚…
420
mJ
IAR
Avalanche Current

22
A
EAR
Repetitive Avalanche Energy

16
mJ
dv/dt
Peak Diode Recovery dv/dt
ƒ…
5.0
V/ns
TJ
Operating Junction and
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
°C
S
D
G
TO-262
TO-263
2014-8-30
1
www.kersemi.com


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