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TD3051 Datenblatt(PDF) 4 Page - Solid State Optronic |
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TD3051 Datenblatt(HTML) 4 Page - Solid State Optronic |
4 / 9 page © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 4 of 9 TD3051 /H/S/TR Rev 2.01 (11/12/2013) 001695 TD3051 Random Phase Switching 600V Triac Driver Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s TD3051 Solder Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 1 |
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