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TS3A4741 Datenblatt(PDF) 4 Page - Texas Instruments

Teilenummer TS3A4741
Bauteilbeschribung  TS3A474x 0.9-廓 Low-Voltage Single-Supply 2-Channel SPST Analog Switches
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
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TS3A4741 Datenblatt(HTML) 4 Page - Texas Instruments

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TS3A4741, TS3A4742
SCDS228E – AUGUST 2006 – REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage reference to GND(2)
–0.3
4
VNO
V
VCOM
Analog and digital voltage
–0.3
VCC + 0.3
VIN
INO
On-state switch current
VNO, VCOM = 0 to VCC
–100
100
ICOM
ICC
mA
Continuous current through VCC or GND
±100
IGND
Peak current pulsed at 1 ms, 10% duty cycle
COM, VNO, VCOM
±200
TA
Operating temperature
–40
85
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Signals on COM or NO exceeding VCC or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±4000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±1000
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage reference to ground
1.6
3.6
V
VNO
Analog voltage
0
3.6
VCOM
VIN
Digital Voltage
0
1.8
6.4 Thermal Information
TS3A474x
THERMAL METRIC(1)
DCN/DGK
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
214.8
RθJC(top)
Junction-to-case (top) thermal resistance
191.0
RθJB
Junction-to-board thermal resistance
113.1
°C/W
ψJT
Junction-to-top characterization parameter
52.4
ψJB
Junction-to-board characterization parameter
110.2
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2006–2014, Texas Instruments Incorporated
Product Folder Links: TS3A4741 TS3A4742


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