Datenblatt-Suchmaschine für elektronische Bauteile |
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TS3A4741 Datenblatt(PDF) 4 Page - Texas Instruments |
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TS3A4741 Datenblatt(HTML) 4 Page - Texas Instruments |
4 / 26 page TS3A4741, TS3A4742 SCDS228E – AUGUST 2006 – REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage reference to GND(2) –0.3 4 VNO V VCOM Analog and digital voltage –0.3 VCC + 0.3 VIN INO On-state switch current VNO, VCOM = 0 to VCC –100 100 ICOM ICC mA Continuous current through VCC or GND ±100 IGND Peak current pulsed at 1 ms, 10% duty cycle COM, VNO, VCOM ±200 TA Operating temperature –40 85 TJ Junction temperature 150 °C Tstg Storage temperature –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Signals on COM or NO exceeding VCC or GND are clamped by internal diodes. Limit forward diode current to maximum current rating. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1000 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage reference to ground 1.6 3.6 V VNO Analog voltage 0 3.6 VCOM VIN Digital Voltage 0 1.8 6.4 Thermal Information TS3A474x THERMAL METRIC(1) DCN/DGK UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 214.8 RθJC(top) Junction-to-case (top) thermal resistance 191.0 RθJB Junction-to-board thermal resistance 113.1 °C/W ψJT Junction-to-top characterization parameter 52.4 ψJB Junction-to-board characterization parameter 110.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated Product Folder Links: TS3A4741 TS3A4742 |
Ähnliche Teilenummer - TS3A4741_15 |
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Ähnliche Beschreibung - TS3A4741_15 |
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