Datenblatt-Suchmaschine für elektronische Bauteile |
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ISL22326UFV14Z Datenblatt(PDF) 3 Page - Intersil Corporation |
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ISL22326UFV14Z Datenblatt(HTML) 3 Page - Intersil Corporation |
3 / 17 page 3 FN6176.3 September 9, 2015 Pin Descriptions TSSOP PIN NUMBER QFN PIN NUMBER PIN NAME DESCRIPTION 115 VCC Power supply pin 2 16 SHDN Shutdown active low input 3 1 RH0 “High” terminal of DCP0 4 2 RL0 “Low” terminal of DCP0 5 3 RW0 “Wiper” terminal of DCP0 6 5 A2 Device address input for the I2C interface 7 6 SCL Open drain I2C interface clock input 8 7 SDA Open drain Serial data I/O for the I2C interface 9 8 GND Device ground pin 10 10 RW1 “Wiper” terminal of DCP1 11 11 RL1 “Low” terminal of DCP1 12 12 RH1 “High” terminal of DCP1 13 13 A0 Device address input for the I2C interface 14 14 A1 Device address input for the I2C interface 4, 9 NC No connection EPAD* Exposed Die Pad internally connected to GND *Note: PCB thermal land for QFN EPAD should be connected to GND plane or left floating. For more information refer to http://www.intersil.com/data/tb/TB389.pdf ISL22326 |
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