Datenblatt-Suchmaschine für elektronische Bauteile |
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LM3209-G3 Datenblatt(PDF) 2 Page - Texas Instruments |
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LM3209-G3 Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 22 page Top View Bottom View A1 A2 A3 D1 D2 B1 B2 B3 C1 C2 C3 D3 A1 A2 A3 D1 D2 D3 B1 B2 B3 C1 C2 C3 LM3209-G3 SNVS626B – NOVEMBER 2009 – REVISED MARCH 2013 www.ti.com CONNECTION DIAGRAMS AND PACKAGE MARK INFORMATION Figure 1. 12–Bump Thin DSBGA Package, Large Bump PIN DESCRIPTIONS Pin # Name Description A1 NC This pin is shorted to ground internally. Leave this pin floating. B1 VCON Output voltage program pin. Analog voltage from DAC/controller to set VOUT. C1 FB Feedback input to inverting input of error amplifier. Connect output voltage directly to this node at load point. D1 VOUT Regulated output voltage of LM3209-G3. Connect this to a 4.7 µF ceramic output filter capacitor to GND. A2 NC Supply voltage for analog circuits of LM3209-G3. This pin is connected to PVIN via a 36 Ω resistor internally. Leave this pin floating. B2 EN Enable Pin. Pulling this pin higher than 1.2V enables part to function. C2 SGND Signal Ground for analog circuits. D2 SW2 Switch pin for Internal Power Switches M3 and M4. Connect inductor between SW1 and SW2. A3 PVIN Power MOSFET input and power current input pin. Optional low-pass filtering may help buck and buck-boost modes for radiated EMI and noise reduction. B3 PVIN Power MOSFET input and power current input pin. Optional low-pass filtering may help buck and buck-boost modes for radiated EMI and noise reduction. C3 SW1 Switch pin for Internal Power Switches M1 and M2. Connect inductor between SW1 and SW2. D3 PGND Power Ground for Power MOSFETs and gate drive circuitry. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 2 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3209-G3 |
Ähnliche Teilenummer - LM3209-G3_15 |
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Ähnliche Beschreibung - LM3209-G3_15 |
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