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LM3209-G3 Datenblatt(PDF) 2 Page - Texas Instruments

Teilenummer LM3209-G3
Bauteilbeschribung  LM3209-G3 Seamless-Transition Buck-Boost Converter for Battery-Powered 3G/4G RF Power Amplifiers
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LM3209-G3 Datenblatt(HTML) 2 Page - Texas Instruments

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A1
A2
A3
D1
D2
B1
B2
B3
C1
C2
C3
D3
A1
A2
A3
D1
D2
D3
B1
B2
B3
C1
C2
C3
LM3209-G3
SNVS626B – NOVEMBER 2009 – REVISED MARCH 2013
www.ti.com
CONNECTION DIAGRAMS AND PACKAGE MARK INFORMATION
Figure 1. 12–Bump Thin DSBGA Package, Large Bump
PIN DESCRIPTIONS
Pin #
Name
Description
A1
NC
This pin is shorted to ground internally. Leave this pin floating.
B1
VCON
Output voltage program pin. Analog voltage from DAC/controller to set VOUT.
C1
FB
Feedback input to inverting input of error amplifier. Connect output voltage directly to this node
at load point.
D1
VOUT
Regulated output voltage of LM3209-G3. Connect this to a 4.7 µF ceramic output filter
capacitor to GND.
A2
NC
Supply voltage for analog circuits of LM3209-G3. This pin is connected to PVIN via a 36
resistor internally. Leave this pin floating.
B2
EN
Enable Pin. Pulling this pin higher than 1.2V enables part to function.
C2
SGND
Signal Ground for analog circuits.
D2
SW2
Switch pin for Internal Power Switches M3 and M4. Connect inductor between SW1 and SW2.
A3
PVIN
Power MOSFET input and power current input pin. Optional low-pass filtering may help buck
and buck-boost modes for radiated EMI and noise reduction.
B3
PVIN
Power MOSFET input and power current input pin. Optional low-pass filtering may help buck
and buck-boost modes for radiated EMI and noise reduction.
C3
SW1
Switch pin for Internal Power Switches M1 and M2. Connect inductor between SW1 and SW2.
D3
PGND
Power Ground for Power MOSFETs and gate drive circuitry.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
2
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Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LM3209-G3


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