LM25011, LM25011-Q1, LM25011A, LM25011A-Q1

SNVS617H – APRIL 2009 – REVISED NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

45

V

BST to SGND

52

V

SW to SGND (Steady State)

–1.5

45

V

BST to SW

–0.3

7

V

CS to CSG

–0.3

0.3

V

CSG to SGND

–0.3

0.3

V

PGD to SGND

–0.3

7

V

SS to SGND

–0.3

3

V

RT to SGND

–0.3

1

V

FB to SGND

–0.3

7

V

For soldering specs, see www.ti.com/packaging.

Junction Temperature

150

°C

(1)

Absolute Maximum Ratings(1) are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical

Characteristics .

6.2 Handling Ratings: LM25011

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Handling Ratings: LM25011-Q1

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

2000

Corner pins (1, 5, 6,

750

Electrostatic discharge

V

Charged device model (CDM), per

and 10)

AEC Q100-011

Other pins

750

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN Voltage

6.0

42

V

Junction Temperature

–40

125

°C

(1)

Absolute Maximum Ratings(1) are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical

Characteristics .

4

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