MC33063A-Q1

SLLS654C – APRIL 2005 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

40

V

–0.3

40

V

40

V

40

V

40

V

40

V

100

mA

1.5

A

150

°C

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

Corner pins (1, 4, 5, and 8)

±750

V

Charged device model (CDM), per

AEC Q100-011

Other pins

±500

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN

NOM MAX

UNIT

Supply voltage

3

40

V

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

MC33063A-Q1

D

UNIT

8 PINS

121.9

Junction-to-case (top) thermal resistance

68.1

Junction-to-board thermal resistance

62.3

°C/W

Junction-to-top characterization parameter

19.9

Junction-to-board characterization parameter

61.8

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

(3)

The package thermal impedance is calculated in accordance with JESD 51-7.

4

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