Datenblatt-Suchmaschine für elektronische Bauteile |
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TMP175AQDGKRQ1 Datenblatt(PDF) 4 Page - Texas Instruments |
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TMP175AQDGKRQ1 Datenblatt(HTML) 4 Page - Texas Instruments |
4 / 31 page TMP175-Q1, TMP75-Q1 SBOS759 – NOVEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Power supply, V+ 7 V Input voltage(2) –0.5 7 V Input current 10 mA Operating temperature –55 127 °C Junction temperature, TJ 150 °C Storage temperature, Tstg –60 130 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input voltage rating applies to all TMP175-Q1 and TMP75-Q1 input voltages. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage 2.7 5.5 V Operating free-air temperature, TA –40 125 °C 6.4 Thermal Information TMP175-Q1, TMP75-Q1 THERMAL METRIC(1) DGK (SOIC), D (VSSOP) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 185 °C/W RθJC(top) Junction-to-case (top) thermal resistance 76.1 °C/W RθJB Junction-to-board thermal resistance 106.4 °C/W ψJT Junction-to-top characterization parameter 14.1 °C/W ψJB Junction-to-board characterization parameter 104.8 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TMP175-Q1 TMP75-Q1 |
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