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TL1431QDREP Datenblatt(PDF) 4 Page - Texas Instruments

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Teilenummer TL1431QDREP
Bauteilbeschribung  Precision-Programmable Reference
Download  23 Pages
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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TL1431-EP
SLVS529D – APRIL 2004 – REVISED JANUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Cathode voltage(2), VKA
37
V
Continuous cathode current, IKA
–100
150
mA
Reference input current, II(ref)
–0.00005
10
mA
Operating virtual junction temperature(3), TJ
150
°C
Lead temperature 1.6 mm (1/16 inch) from case for 10 s
260
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to ANODE, unless otherwise noted.
(3)
Long-term high-temperature storage and/or use at the absolute maximum ratings may result in a reduction of overall device life. See
www.ti.com/ep_quality for additional information on enhanced plastic packaging.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±4000
Electrostatic
V(ESD)
V
discharge
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
±2000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
VKA
Cathode voltage
VI(ref)
36
V
IKA
Cathode current
1
100
mA
TA
Operating free-air temperature
–55
125
°C
7.4 Thermal Information
TL1431-EP
THERMAL METRIC(1)
D
UNIT
8 PINS
RθJA(high)
Junction-to-ambient thermal resistance (high K board)
97
°C/W
RθJA(low)
Junction-to-ambient thermal resistance (low K board)
165
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Dissipation Rating Table
DERATING
TA = 70°C
TA = 85°C
TA = 125°C
PACKAGE
TA ≤ 25°C
FACTOR
ABSOLUTE
ABSOLUTE
ABSOLUTE
PACKAGE
THERMAL
POWER RATING
ABOVE TA =
MAXIMUM
MAXIMUM
MAXIMUM
IMPEDANCE
25°C
POWER RATING
POWER RATING
POWER RATING
97°C/W (High K
10 mW/°C
824 mW
670 mW
257 mW
board)
D
1102 mW
165°C/W (Low K
6 mW/°C
484 mW
393 mW
151 mW
board)
4
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