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TL1431QDREP Datenblatt(PDF) 4 Page - Texas Instruments |
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TL1431QDREP Datenblatt(HTML) 4 Page - Texas Instruments |
4 / 23 page TL1431-EP SLVS529D – APRIL 2004 – REVISED JANUARY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Cathode voltage(2), VKA 37 V Continuous cathode current, IKA –100 150 mA Reference input current, II(ref) –0.00005 10 mA Operating virtual junction temperature(3), TJ 150 °C Lead temperature 1.6 mm (1/16 inch) from case for 10 s 260 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to ANODE, unless otherwise noted. (3) Long-term high-temperature storage and/or use at the absolute maximum ratings may result in a reduction of overall device life. See www.ti.com/ep_quality for additional information on enhanced plastic packaging. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±2000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT VKA Cathode voltage VI(ref) 36 V IKA Cathode current 1 100 mA TA Operating free-air temperature –55 125 °C 7.4 Thermal Information TL1431-EP THERMAL METRIC(1) D UNIT 8 PINS RθJA(high) Junction-to-ambient thermal resistance (high K board) 97 °C/W RθJA(low) Junction-to-ambient thermal resistance (low K board) 165 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.5 Dissipation Rating Table DERATING TA = 70°C TA = 85°C TA = 125°C PACKAGE TA ≤ 25°C FACTOR ABSOLUTE ABSOLUTE ABSOLUTE PACKAGE THERMAL POWER RATING ABOVE TA = MAXIMUM MAXIMUM MAXIMUM IMPEDANCE 25°C POWER RATING POWER RATING POWER RATING 97°C/W (High K 10 mW/°C 824 mW 670 mW 257 mW board) D 1102 mW 165°C/W (Low K 6 mW/°C 484 mW 393 mW 151 mW board) 4 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated |
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