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TMP103DYFFT Datenblatt(PDF) 10 Page - Texas Instruments

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Teilenummer TMP103DYFFT
Bauteilbeschribung  Low-Power, Digital Temperature Sensor
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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TMP103DYFFT Datenblatt(HTML) 10 Page - Texas Instruments

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TMP103
SCL
V+
SDA
GND
Diode Temp.
Sensor
Control Logic
A/D
Converter
Serial
Interface
Oscillator
Registers
Temperature
TMP103
0.01mF
V+
GND
2
5
1
SCL
6
SDA
To
Two-Wire
Controller
TMP103
SBOS545B – FEBRUARY 2011 – REVISED JANUARY 2016
www.ti.com
7 Detailed Description
7.1 Overview
The TMP103 is a digital output temperature sensor in a wafer chip-scale package (WCSP) that is optimal for
thermal management and thermal profiling. The TMP103 includes a two-wire interface that is compatible with
both I2C and SMBus interfaces. In addition, the TMP103 has the capability of executing multiple device access
(MDA) commands that allow multiple TMP103 devices to respond to a single global bus command. MDA
commands reduce communication time and power in a bus that contains multiple TMP103 devices. The TMP103
is specified over a temperature range of –40ºC to 125 ºC.
The TMP103 serial interface is designed to support up to eight TMP103 devices on a single bus. The TMP103 is
offered with eight internal interface addresses. Each unique address option can be used as a location or
temperature zone designator. The TMP103 responds to standard I2C and SMBus slave protocols that allow the
internal registers to be written to or read from on an individual basis. The TMP103 also responds to MDA
commands that allow all the devices on the bus to be written to or read from, without having to send the
individual address and commands to each device.
Pullup resistors are required on SCL and SDA. TI also recommends a 0.01-
μF bypass capacitor, as shown in
Figure 11.
NOTE: SCL and SDA pins require pullup resistors.
Figure 11. Typical Connections
The temperature sensor in the TMP103 is the chip itself. Thermal paths run through the package bumps as well
as the package. The lower thermal resistance of metal causes the bumps to provide the primary thermal path.
To maintain accuracy in applications that require air or surface temperature measurement, take care to isolate
the package from ambient air temperature.
7.2 Functional Block Diagram
10
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Copyright © 2011–2016, Texas Instruments Incorporated
Product Folder Links: TMP103


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