74F174SJ datasheet(5/8 Pages) NSC

Teilenummer	74F174SJ

Bauteilbeschribung	Hex D Flip-Flop with Master Reset

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Hersteller	NSC [National Semiconductor (TI)]

Direct Link	http://www.national.com

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5 / 8 page

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are

defined as follows

74F

174

S

C

X

Temperature Range Family

Special Variations

74F e Commercial

QB e Military grade device with

54F e Military

environmental and burn-in

processing

Device Type

X e Devices shipped in 13 reel

Package Code

Temperature Range

P e Plastic DIP

C e Commercial (0 Cto a70 C)

D e Ceramic DIP

M e Military (b55 Cto a125 C)

F e Flatpak

L e

Leadless Chip Carrier (LCC)

S e Small Outline SOIC JEDEC

SS e Small Outline SOIC EIAJ

Physical Dimensions inches (millimeters)

20-Terminal Ceramic Leadless Chip Carrier (L)

NS Package Number E20A

5

Ähnliche Beschreibung - 74F174SJ

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
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Renesas Technology Corp	HD74AC174	210Kb / 8P	Hex D-Type Flip-Flop with Master Reset
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Fairchild Semiconductor	74F174	79Kb / 7P	Hex D-Type Flip-Flop with Master Reset
ON Semiconductor	MC10H186	100Kb / 4P	Hex D Master-Slave Flip-Flop with Reset 1996 REV 5
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