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LM3281 Datenblatt(PDF) 4 Page - Texas Instruments |
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LM3281 Datenblatt(HTML) 4 Page - Texas Instruments |
4 / 26 page LM3281 SNVSA38 – NOVEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN pin to GND pin voltage –0.2 6 V EN, FB, MODE, SW pins to GND pin –0.2 VIN + 0.2 or 6 voltage (whichever is smaller) Junction temperature (TJ) 150 °C Continuous power dissipation(3) Internally limited Maximum lead temperature (soldering) 260 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Internal thermal shutdown circuitry protects the device from permanent damage. It engages at TJ = 150°C (typ.) and disengages at TJ = 125°C (typ.). 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –1000 1000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification –250 250 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage (with respect to GND pin) 3 5.5 V ILOAD (1) Output current 0 1200 mA ILOAD_BURST (1) Output current, short bursts (< 100 µS burst at < 10% duty cycle) 0 1400 EN EN pin voltage (with respect to GND pin) 0 VIN V MODE Mode select pin voltage (with respect to GND pin) 0 VIN TJ Junction temperature –30 125 TA Ambient temperature –30 90 °C TB PC board temperature –30 105 (1) Refer to section High Maximum Current in this data sheet for load current use case profile. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LM3281 |
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