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LM1458M/NOPB Datenblatt(PDF) 5 Page - Texas Instruments

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Teilenummer LM1458M/NOPB
Bauteilbeschribung  Dual Operational Amplifier
Download  12 Pages
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM1458M/NOPB Datenblatt(HTML) 5 Page - Texas Instruments

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PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
LM1458 MWC
ACTIVE
WAFERSALE
YS
0
1
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-40 to 85
LM1458M
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
LM
1458M
LM1458M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM
1458M
LM1458MX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
LM
1458M
LM1458MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM
1458M
LM1458N/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 70
LM1458N
LM1558H
ACTIVE
TO-99
LMC
8
500
TBD
Call TI
Call TI
-55 to 125
( LM1558H ~
LM1558H)
LM1558H/NOPB
ACTIVE
TO-99
LMC
8
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
( LM1558H ~
LM1558H)
MC1458CP1
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
0 to 70
LM1458N
MC1458P1
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
0 to 70
LM1458N
MC1558G
ACTIVE
TO-99
LMC
8
500
TBD
Call TI
Call TI
-55 to 125
( LM1558H ~
LM1558H)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.


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