TPA3121D2

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SLOS537B – MAY 2008 – REVISED JANUARY 2014

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

Supply voltage

AVCC, PVCC

–0.3 to 30

V

Logic input voltage

SD, MUTE, GAIN0, GAIN1

V

Analog input voltage

RIN, LIN

–0.3 to 7

V

Continuous total power dissipation

See the Thermal Inforamtion Table

Operating free-air temperature range

–40 to 85

°C

Operating junction temperature range

–40 to 150

°C

Storage temperature range

–65 to 150

°C

SE Output Configuration

3.2

Load resistance (minimum value)

Ω

BTL Output Configuration

6.4

Human body model (all pins)

±2

kV

ESD

Electrostatic Discharge

Charged-device model (all

±500

V

pins)

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPA3121D2

PWP

UNITS

24 PINS

Junction-to-ambient thermal resistance

30.9

Junction-to-case (top) thermal resistance

29.6

Junction-to-board thermal resistance

9.0

°C/W

Junction-to-top characterization parameter

0.5

Junction-to-board characterization parameter

3.6

Junction-to-case (bottom) thermal resistance

0.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Supply voltage

PVCC, AVCC

10

26

V

High-level input voltage

SD, MUTE, GAIN0, GAIN1

2

V

Low-level input voltage

SD, MUTE, GAIN0, GAIN1

0.8

V

125

High-level input current

125

μA

125

1

Low-level input current

1

μA

1

Operating free-air temperature

–40

85

°C

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