CYStech Electronics Corp.

Spec. No. : C967Q8

Issued Date : 2016.09.21

Revised Date :

Page No. : 9/9

MTB040P04Q8

CYStek Product Specification

SOP-8 Dimension

Millimeters

Inches

Millimeters

Inches

Marking:

B040

Device Name

P04

Date Code

Date Code(counting from left to right) :

May→E, Jun→F, Jul→G, Aug→H, Sep→J,

Oct→K, Nov→L, Dec→M

8-Lead SOP-8 Plastic Package

CYStek Package Code: Q8

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

1.350

1.750

0.053

0.069

E

3.800

4.000

0.150

0.157

A1

0.100

0.250

0.004

0.010

E1

5.800

6.200

0.228

0.244

A2

1.350

1.550

0.053

0.061

e

1.270 (BSC)

0.050 (BSC)

b

0.330

0.510

0.013

0.020

L

0.400

1.270

0.016

0.050

c

0.170

0.250

0.006

0.010

θ

0

8°

0

8°

D

4.700

5.100

0.185

0.200

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.