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TS3USB3200RSVR Datenblatt(PDF) 4 Page - Texas Instruments

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Teilenummer TS3USB3200RSVR
Bauteilbeschribung  USB 2.0 Applications
Download  23 Pages
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TS3USB3200RSVR Datenblatt(HTML) 4 Page - Texas Instruments

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TS3USB3200
SCDS333B – JUNE 2012 – REVISED JULY 2016
www.ti.com
Product Folder Links: TS3USB3200
Submit Documentation Feedback
Copyright © 2012–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3)
All voltages are with respect to ground, unless otherwise specified.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VCC ,VBUS
Supply voltage(3)
–0.3
5.5
V
VI/O
Input/Output DC voltage(3)
–0.5
5.5
V
IK
Input/Output port diode current
VI/O < 0
–50
mA
VI
Digital input voltage range (SEL1, SEL2, PSEL)
–0.3
5.5
V
IIK
Digital logic input clamp current(3)
VI < 0
–50
mA
ICC
Continuous current through VCC
100
mA
IGND
Continuous current through GND
–100
mA
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±3500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
VCC
Supply voltage
2.7
4.3
V
VBUS
VBUS Supply voltage
4.3
5.5
V
VI/O (USB)
VI/O (ID)
Analog voltage for USB and ID signal path
0
3.6
V
VI/O (MHL)
Analog voltage for MHL signal path
1.6
3.4
V
VI
Digital input voltage (SEL1, SEL2, PSEL)
0
VCC
V
TRAMP (VCC)
Power supply ramp time requirement (VCC)
100
1000
μs/V
TRAMP (VBUS)
Power supply ramp time requirement (VBUS)
100
1000
μs/V
TA
Operating free-air temperature
–40
85
ºC
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
The package thermal impedance is calculated in accordance with JESD 51-7.
6.4 Thermal Information
THERMAL METRIC(1)
TS3USB3200
UNIT
RSV (UQFN)
16 PINS
RθJA
Junction-to-ambient thermal resistance(2)
109.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
36
°C/W
RθJB
Junction-to-board thermal resistance
46.4
°C/W
ψJT
Junction-to-top characterization parameter
1
°C/W
ψJB
Junction-to-board characterization parameter
49.7
°C/W


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