MC10EP01, MC100EP01

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3

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

PECL Mode Power Supply

6

V

NECL Mode Power Supply

−6

V

PECL Mode Input Voltage

NECL Mode Input Voltage

6

−6

V

Output Current

Continuous

Surge

50

100

mA

±0.5

mA

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

SOIC−8 NB

SOIC−8 NB

190

130

°C/W

Thermal Resistance (Junction-to-Case)

Standard Board

SOIC−8 NB

41 to 44

°C/W

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

TSSOP−8

TSSOP−8

185

140

°C/W

Thermal Resistance (Junction-to-Case)

Standard Board

TSSOP−8

41 to 44

°C/W

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

DFN8

DFN8

129

84

°C/W

Wave Solder (Pb-Free)

< 2 to 3 sec @ 260°C

265

°C

Thermal Resistance (Junction-to-Case)

(Note 2)

DFN8

35 to 40

°C/W

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)