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BU2099FV Datenblatt(PDF) 8 Page - Rohm

Teilenummer BU2099FV
Bauteilbeschribung  4-input Serial-in / Parallel-out Drivers
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Hersteller  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

BU2099FV Datenblatt(HTML) 8 Page - Rohm

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BU2099FV
TSZ02201-0RHR1GZ00140-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
18.Sep.2015 Rev.002
www.rohm.com
TSZ22111・15・001
I/O Equivalence Circuits
SO
Q0~Q11
Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θJA (°C/W).The temperature of IC inside the package can be estimated by
this thermal resistance. Figure 7 shows the model of thermal resistance of the package. Thermal resistance θJA, ambient
temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the equation below:
θJA = (TJmax - TA) / PD
(°C/W)
Derating curve in Figure 8 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition.
OE
VDD
VDD
VSS
Qx
SO
VDD
VDD
DATA,CLOCK,LCK
VSS
VSS
VSS
VSS
DATA
CLOCK
LCK
VDD
VDD
VSS
VSS
OE
Figure 8. Derating Curve
Figure 7. Thermal resistance
周囲温度
Ta [℃]
チップ 表面温度
Tj [℃]
消費電力 P [W]
Ambient temperature TA (℃)
Chip surface temperature TJ(℃)
Power dissipation PD (W)
θJA =( TJmax - TA)/ PD (°C/W)
85
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
25
50
75
100
125
Ambient Temperature [℃]


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