Datenblatt-Suchmaschine für elektronische Bauteile |
|
MC74VHCT259ADR2G Datenblatt(PDF) 4 Page - ON Semiconductor |
|
MC74VHCT259ADR2G Datenblatt(HTML) 4 Page - ON Semiconductor |
4 / 9 page MC74VHCT259A http://onsemi.com 4 MAXIMUM RATINGS Symbol Parameter Value Unit VCC Positive DC Supply Voltage −0.5 to +7.0 V VIN Digital Input Voltage −0.5 to +7.0 V VOUT DC Output Voltage Output in 3−State High or Low State −0.5 to +7.0 −0.5 to VCC +0.5 V IIK Input Diode Current −20 mA IOK Output Diode Current $20 mA IOUT DC Output Current, per Pin $25 mA ICC DC Supply Current, VCC and GND Pins $75 mA PD Power Dissipation in Still Air SOIC TSSOP 200 180 mW TSTG Storage Temperature Range −65 to +150 °C VESD ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) >2000 >200 >2000 V ILATCHUP Latchup Performance Above VCC and Below GND at 125°C (Note 4) $300 mA qJA Thermal Resistance, Junction−to−Ambient SOIC TSSOP 143 164 °C/W Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22−A114−A 2. Tested to EIA/JESD22−A115−A 3. Tested to JESD22−C101−A 4. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC DC Supply Voltage 4.5 5.5 V VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage Output in 3−State High or Low State 0 0 5.5 VCC V TA Operating Temperature Range, all Package Types −55 125 °C tr, tf Input Rise or Fall Time VCC = 5.0 V + 0.5 V 0 20 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 TIME, YEARS FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR Figure 5. Failure Rate vs. Time Junction Temperature |
Ähnliche Teilenummer - MC74VHCT259ADR2G |
|
Ähnliche Beschreibung - MC74VHCT259ADR2G |
|
|
Link URL |
Privatsphäre und Datenschutz |
ALLDATASHEETDE.COM |
War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |