MC74VHCT259ADR2G datasheet(4/9 Pages) ONSEMI

Teilenummer	MC74VHCT259ADR2G

Bauteilbeschribung	8-Bit Addressable Latch/1-of-8 Decoder CMOS Logic Level Shifter

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MC74VHCT259A

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MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

VCC

Positive DC Supply Voltage

−0.5 to +7.0

V

VIN

Digital Input Voltage

−0.5 to +7.0

V

VOUT

DC Output Voltage

Output in 3−State

High or Low State

−0.5 to +7.0

−0.5 to VCC +0.5

V

IIK

Input Diode Current

−20

mA

IOK

Output Diode Current

$20

mA

IOUT

DC Output Current, per Pin

$25

mA

ICC

DC Supply Current, VCC and GND Pins

$75

mA

PD

Power Dissipation in Still Air

SOIC

TSSOP

200

180

mW

TSTG

Storage Temperature Range

−65 to +150

°C

VESD

ESD Withstand Voltage

Human Body Model (Note 1)

Machine Model (Note 2)

Charged Device Model (Note 3)

>2000

>200

>2000

V

ILATCHUP

Latchup Performance

Above VCC and Below GND at 125°C (Note 4)

$300

mA

qJA

Thermal Resistance, Junction−to−Ambient

SOIC

TSSOP

143

164

°C/W

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Tested to EIA/JESD22−A114−A

2. Tested to EIA/JESD22−A115−A

3. Tested to JESD22−C101−A

4. Tested to EIA/JESD78

RECOMMENDED OPERATING CONDITIONS

Symbol

Characteristics

Min

Max

Unit

VCC

DC Supply Voltage

4.5

5.5

V

VIN

DC Input Voltage

0

5.5

V

VOUT

DC Output Voltage

Output in 3−State

High or Low State

0

5.5

VCC

V

TA

Operating Temperature Range, all Package Types

−55

125

°C

tr, tf

Input Rise or Fall Time

VCC = 5.0 V + 0.5 V

0

20

ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

DEVICE JUNCTION TEMPERATURE VERSUS TIME TO

0.1% BOND FAILURES

Junction

Temperature

°C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

10

100

1000

TIME, YEARS

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 5. Failure Rate vs. Time Junction Temperature

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