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BAS70 Datenblatt(PDF) 4 Page - STMicroelectronics

Teilenummer BAS70
Bauteilbeschribung  Low forward and reverse recovery times
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

BAS70 Datenblatt(HTML) 4 Page - STMicroelectronics

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Characteristics
BAS70
4/14
Doc ID 12563 Rev 2
Figure 7.
Forward voltage drop versus
forward current (typical values)
Figure 8.
Differential forward resistance
versus forward current
(typical values)
1.E-01
1.E+00
1.E+01
1.E+02
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IFM(mA)
Tj=125 °C
Tj=25 °C
VFM(V)
10
100
1000
0.1
1.0
10.0
F=100 MHz
Tj=25 °C
R( )
F
Ω
IF(mA)
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 10.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
10
100
1000
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
Z
th(j-a)(°C/W)
Single pulse
SOT-323-6L
tP(s)
printed circuit board, epoxy FR4 e
= 35 µm SOT-323-6L
CU
0.01
0.10
1.00
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
Z
th(j-a)/Rth(j-a)
Single pulse
SOT-23
Aluminesubstrate
10 x 8 x 0.5 mm
tP(s)
alluminium oxide substrate 10 x 8 x 0.5 mm SOT-23
Figure 11.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 12.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
0.01
0.10
1.00
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
Z
th(j-a)/Rth(j-a)
Single pulse
SOD-323
EpoxyFR4
S
CU=2.25 mm²
e
CU=35 µm
tP(s)
printed circuit board, epoxy FR4 e
= 35 µm SOD-323
CU
0.01
0.10
1.00
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Z
th(j-a)/Rth(j-a)
Single pulse
SOT-666
Epoxy FR4
e
CU=35 µm
tP(s)
printed circuit board, epoxy FR4 e
= 35 µm SOT-666
CU


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