www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

(0.6)

(1.4)

4X (0.22)

(0.8)

(

) VIA

0.2

4X (0.4)

(R

) TYP

0.05

2X (0.5)

X2SON - 0.4 mm max height

DMR0004A

PLASTIC SMALL OUTLINE - NO LEAD

4222825/A 03/2016

SYMM

1

2

3

4

SYMM

LAND PATTERN EXAMPLE

SCALE:35X

5

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.

It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)