Datenblatt-Suchmaschine für elektronische Bauteile |
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SMBG4761A Datenblatt(PDF) 1 Page - Microsemi Corporation |
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SMBG4761A Datenblatt(HTML) 1 Page - Microsemi Corporation |
1 / 3 page SILICON 2.0 Watt ZENER DIODES SCOTTSD A L E DIVISION SMBG4728 thru SMBG4764A SMBJ4728 thru SMBJ4764A DESCRIPTION APPEARANCE The SMBJ4728A-4764A and SMBG4728A-4764A series of surface mount 2.0 watt Zeners provides voltage regulation in a selection from 3.3 to 100 volts with different tolerances as identified by suffix letter on the part number. This surface mount product series with lower thermal resistance features is equivalent to the JEDEC registered 1N4728 thru 1N4764A with identical electrical characteristics except it is rated at 2.0 W instead of 1.0 W. It is available in J-bend design (SMBJ) with the DO-214AA package for greater PC board mounting density or in Gull-wing design (SMBG) in the DO-215AA for visible solder connections. Microsemi also offers numerous other Zener products to meet higher and lower power applications. NOTE: All SMB series are equivalent to prior SMS package identifications. IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • Surface mount equivalent to 1N4728 to 1N4764A • Ideal for high-density and low-profile mounting • Zener voltage available 3.3V to 200V • Standard voltage tolerances are plus/minus 5% with A suffix and 10 % with no suffix identification • Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively • Options for screening in accordance with MIL-PRF- 19500 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. • Regulates voltage over a broad operating current and temperature range • Wide selection from 3.3 to 100 V • Popular DO-214AA or DO-215AA packages and footprints for either high density J-bend or Gull-wing designs for visible solder joints • Nonsensitive to ESD per MIL-STD-750 Method 1020 • Moisture classification: Level 1 per IPC/JEDEC J- STD-020B with no dry pack required MAXIMUM RATINGS MECHANICAL AND PACKAGING • Power dissipation at 25 ºC: 2.0 watts (also see derating in Figure 1). • Operating and Storage temperature: -65 ºC to +150 ºC • Thermal Resistance: 35 ºC/W junction to lead, or 100 ºC/W junction to ambient when mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page) • Steady-State Power: 2 watts at TL < 80 oC, or 1.25 watts at TA = 25 ºC when mounted on FR4 PC board with recommended footprint (also see Figure 1) • Forward voltage @200 mA: 1.2 volts (maximum) • Solder Temperatures: 260 ºC for 10 s (maximum) • CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 • TERMINALS: Gull-wing or C-bend (modified J- bend) leads, tin-lead plated solderable per MIL-STD- 750, method 2026 • POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to opposite end for Zener regulation • MARKING: Includes part number without prefix (e.g. 4728A, 4734C, 4764D, etc.) • TAPE & REEL option: Standard per EIA-481-1-A with 12 mm tape, 750 per 7 inch reel or 2500 per 13 inch reel (add “TR” suffix to part number) • WEIGHT: 0.1 grams • See package dimensions on last page Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 Page 1 Copyright 2002 8-21-2003 REV C |
Ähnliche Teilenummer - SMBG4761A |
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Ähnliche Beschreibung - SMBG4761A |
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