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LMZM33603 Datenblatt(PDF) 10 Page - Texas Instruments

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Teilenummer LMZM33603
Bauteilbeschribung  4-V to 36-V Input, 3-A Step-Down DC/DC Power Module in QFN Package
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

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PGOOD
VIN
PGND
SW
VOUT
RT
AGND
FB
EN/SYNC
PGOOD
Logic
+
+
VREF
Comp
Power
Stage
and
Control
Logic
Thermal
Shutdown
Shutdown
Logic
OCP
VIN
UVLO
Oscillator
Soft
Start
Sync
Detect
Precision
Enable
Copyright © 2017, Texas Instruments Incorporated
6.8µH
10
LMZM33603
SNVSAO6C – SEPTEMBER 2017 – REVISED MARCH 2018
www.ti.com
Product Folder Links: LMZM33603
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
7 Detailed Description
7.1 Overview
The LMZM33603 is a full-featured, 36-V input, 3-A, synchronous, step-down converter with PWM, MOSFETs,
shielded inductor, and control circuitry integrated into a low-profile, overmolded package. The device integration
enables small designs, while providing the ability to adjust key parameters to meet specific design requirements.
The LMZM33603 provides an output voltage range of 1 V to 18 V. An external resistor divider is used to adjust
the output voltage to the desired value. The switching frequency can also be adjusted, by either an external
resistor or a sync signal, which allows the LMZM33603 to accommodate a variety of input and output voltage
conditions as well as optimize efficiency. The device provides accurate voltage regulation over a wide load range
by using a precision internal voltage reference. Input undervoltage lockout is internally set at 3.6 V (typical), but
can be adjusted upward using a resistor divider on the EN/SYNC pin of the device. The EN/SYNC pin can also
be pulled low to put the device into standby mode to reduce input quiescent current. A power-good signal is
provided to indicate when the output is within its nominal voltage range. Thermal shutdown and current limit
features protect the device during an overload condition. An 18-pin, QFN package that includes exposed bottom
pads provides a thermally enhanced solution for space-constrained applications.
7.2 Functional Block Diagram


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