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CY7C1618KV18 Datenblatt(PDF) 1 Page - Cypress Semiconductor

Teilenummer CY7C1618KV18
Bauteilbeschribung  144-Mbit DDR II SRAM Two-Word Burst Architecture
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Hersteller  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

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CY7C1618KV18/CY7C1620KV18
144-Mbit DDR II SRAM Two-Word
Burst Architecture
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 001-44274 Rev. *N
Revised November 30, 2017
144-Mbit DDR II SRAM Two-Word Burst Architecture
Features
144-Mbit density (8M × 18, 4M × 36)
333 MHz clock for high bandwidth
Two-word burst for reducing address bus frequency
Double data rate (DDR) interfaces (data transferred at
666 MHz) at 333 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Synchronous internally self-timed writes
DDR II operates with 1.5-cycle read latency when DOFF is
asserted high
Operates similar to DDR I device with one cycle read latency
when DOFF is asserted low
1.8-V core power supply with high-speed transceiver logic
(HSTL) inputs and outputs
Variable drive HSTL output buffers
Expanded HSTL output voltage (1.4 V–VDD)
Supports both 1.5-V and 1.8-V I/O supply
Available in 165-ball fine-pitch ball grid array (FBGA) package
(15 × 17 × 1.4 mm)
Offered in Pb-free packages
JTAG 1149.1 compatible test access port
Phase locked loop (PLL) for accurate data placement
Configuration
CY7C1618KV18 – 8M × 18
CY7C1620KV18 – 4M × 36
Functional Description
The
CY7C1618KV18,
and
CY7C1620KV18
are
1.8-V
synchronous pipelined SRAM equipped with DDR II architecture.
The DDR II consists of an SRAM core with advanced
synchronous peripheral circuitry and a 1-bit burst counter.
Addresses for read and write are latched on alternate rising
edges of the input (K) clock. Write data is registered on the rising
edges of both K and K. Read data is driven on the rising edges
of C and C if provided, or on the rising edge of K and K if C/C are
not provided. On CY7C1618KV18 and CY7C1620KV18, the
burst counter takes in the least significant bit of the external
address and bursts two 18-bit words in the case of
CY7C1618KV18 and two 36-bit words in the case of
CY7C1620KV18 sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
For a complete list of related documentation, click here.
Selection Guide
Description
333 MHz
300 MHz
250 MHz
Unit
Maximum operating frequency
333
300
250
MHz
Maximum operating current
× 18
650
610
Not Offered
mA
× 36
790
Not Offered
660


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