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HCPL-6630 Datenblatt(PDF) 5 Page - Agilent(Hewlett-Packard)

Teilenummer HCPL-6630
Bauteilbeschribung  Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers
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Hersteller  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL-6630 Datenblatt(HTML) 5 Page - Agilent(Hewlett-Packard)

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5
Hermetic Optocoupler Options
Option
Description
100
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for
lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
300
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details). This option has solder dipped leads.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1.40 (0.055)
1.65 (0.065)
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.51 (0.020)
MIN.
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5° MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).


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