Datenblatt-Suchmaschine für elektronische Bauteile |
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LTM8003 Datenblatt(PDF) 22 Page - Linear Technology |
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LTM8003 Datenblatt(HTML) 22 Page - Linear Technology |
22 / 30 page LTM8003 22 8003fc For more information www.linear.com/LTM8003 APPLICATIONS INFORMATION diodes inside the LTM8003 can pull large currents from the output through the VIN pin. Figure 4 shows a circuit that runs only when the input voltage is present and that protects against a shorted or reversed input. LTM8003 VIN VIN 8003 F04 RUN Figure4. The Input Diode Prevents a Shorted Input from Discharging a Backup Battery Tied to the Output. It Also Protects the Circuit from a Reversed Input. The LTM8003 Runs Only When the Input Is Present PCB Layout Most of the headaches associated with PCB layout have been alleviated or even eliminated by the high level of integration of the LTM8003. The LTM8003 is neverthe- less a switching power supply, and care must be taken to minimize EMI and ensure proper operation. Even with the high level of integration, you may fail to achieve specified operation with a haphazard or poor layout. See Figure 5 for a suggested layout. Ensure that the grounding and heat sinking are acceptable. A few rules to keep in mind are: 1. Place CFF, RFB and RT as close as possible to their respective pins. 2. Place the CIN capacitor as close as possible to the VIN and GND connection of the LTM8003. 3. Place the COUT capacitor as close as possible to the VOUT and GND connection of the LTM8003. 4. Place the CIN and COUT capacitors such that their ground current flow directly adjacent to or underneath the LTM8003. 5. Connect all of the GND connections to as large a copper pour or plane area as possible on the top layer. Avoid breaking the ground connection between the external components and the LTM8003. 6. Use vias to connect the GND copper area to the board’s internal ground planes. Liberally distribute these GND vias to provide both a good ground connection and thermal path to the internal planes of the printed circuit board. Pay attention to the location and density of the thermal vias in Figure 5. The LTM8003 can benefit from theheat-sinkingaffordedbyviasthatconnecttointernal GND planes at these locations, due to their proximity to internal power handling components. The optimum SYNC GND GND/ THERMAL VIAS RUN BIAS FB VOUT VIN COUT CIN PG TR/SS RT 8003 F05 Figure5. Layout Showing Suggested External Components, GND Plane and Thermal Vias |
Ähnliche Teilenummer - LTM8003 |
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Ähnliche Beschreibung - LTM8003 |
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