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NB7NPQ1004M Datenblatt(PDF) 3 Page - ON Semiconductor |
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NB7NPQ1004M Datenblatt(HTML) 3 Page - ON Semiconductor |
3 / 11 page NB7NPQ1004M www.onsemi.com 3 Table 1. PIN DESCRIPTION Pin Number Pin Name Type Description 1 FGA INPUT DC flat gain for channel A. 4−level input pin. Internal 100 k−W pull−up and 200 k−W pull−down. 2 EN_AB INPUT Channel AB Enable. Internal 300 k−W pull−up. High−Channel is in normal operation. Low− Channel is in power down mode. 3 VDD POWER 3.3 V power supply. VDD pins must be externally connected to power supply. 4 A_RX+ INPUT Channel A Differential CML input pair for 5 / 10 Gbps USB signals. Must be externally AC− coupled in system. UFP/DFP transmitter should provide this capacitor. 5 A_RX− 6 Test1# INPUT Connect to VDD is recommended. 7 VDD POWER 3.3 V power supply. VDD pins must be externally connected to power supply. 8 B_TX+ OUTPUT Channel B Differential output for 5 / 10 Gbps USB signals. Must be externally AC−coupled in system. 9 B_TX− 10 FGC INPUT DC flat gain for channel C. 4−level input pin. Internal 100 k−W pull−up and 200 k−W pull−down. 11 EQC INPUT EQ select for channel C. 4−level input pin. Internal 100 k−W pull−up and 200 k−W pull−down. 12 C_RX− INPUT Channel C Differential CML input pair for 5 / 10 Gbps USB signals. Must be externally AC− coupled in system. UFP/DFP transmitter should provide this capacitor. 13 C_RX+ 14 VDD POWER 3.3 V power supply. VDD pins must be externally connected to power supply. 15 NC NC No Connect pin: connect to VDD is recommended 16 D_TX− OUTPUT Channel D Differential output for 5 / 10 Gbps USB signals. Must be externally AC−coupled in system. 17 D_TX+ 18 EQD INPUT EQ select for channel D. 4−level input pin. Internal 100k−W pull−up and 200 k−W pull−down. 19 FGD INPUT DC flat gain for channel D. 4−level input pin. Internal 100k−W pull−up and 200 k−W pull−down. 20 EN_CD INPUT Channel CD Enable. Internal 300k−W pull−up. High−Channel is in normal operation. Low− Channel is in power down mode. 21 VDD POWER 3.3 V power supply. VDD pins must be externally connected to power supply. 22 D_ RX+ INPUT Channel D Differential CML input pair for 5 / 10 Gbps USB signals. Must be externally AC− coupled in system. UFP/DFP transmitter should provide this capacitor. 23 D_ RX− 24 Test2# INPUT Connect to VDD is recommended. 25 VDD POWER 3.3 V power supply. VDD pins must be externally connected to power supply. 26 C_TX+ OUTPUT Channel C Differential output for 5 / 10 Gbps USB signals. Must be externally AC−coupled in system. 27 C_TX− 28 FGB INPUT DC flat gain for channel B. 4−level input pin. Internal 100 k−W pull−up and 200 k−W pull−down. 29 EQB INPUT EQ select for channel B. 4−level input pin. Internal 100 k−W pull−up and 200 k−W pull−down. 30 B_ RX− INPUT Channel B Differential CML input pair for 5 / 10 Gbps USB signals. Must be externally AC− coupled in system. UFP/DFP transmitter should provide this capacitor. 31 B_ RX+ 32 VDD POWER 3.3 V power supply. VDD pins must be externally connected to power supply. 33 NC NC No Connect pin: connect to VDD is recommended 34 A_TX− OUTPUT Channel A Differential output for 5 / 10 Gbps USB signals. Must be externally AC−coupled in system. 35 A_TX+ 36 VDD POWER 3.3 V power supply. VDD pins must be externally connected to power supply. 37, 38, 39, 40, 41 NC NC No Connect 42 EQA INPUT EQ select for channel A. 4−level input pin. Internal 100k−W pull−up and 200k−W pull−down. EP GND GND Exposed pad (EP). EP on the package bottom is thermally connected to the die for improved heat transfer out of the package. The exposed pad is electrically connected to the die and must be soldered to GND on the PC Board. |
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