Datenblatt-Suchmaschine für elektronische Bauteile |
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DAC8814ICDBR Datenblatt(PDF) 2 Page - Texas Instruments |
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DAC8814ICDBR Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 31 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) DAC8814 SBAS338 – JANUARY 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) MINIMUM RELATIVE DIFFERENTIAL SPECIFIED TRANSPORT ACCURACY NONLINEARITY TEMPERATURE PACKAGE- PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) RANGE LEAD DESIGNATOR NUMBER QUANTITY DAC8814ICDBT Tape and Reel, 250 DAC8814C ±1 ±1 -40 °C to +85°C SSOP-28 DB DAC8814ICDBR Tape and Reel, 2500 DAC8814IBDBT Tape and Reel, 250 DAC8814B ±4 ±1.5 -40 °C to +85°C SSOP-28 DB DAC8814IBDBR Tape and Reel, 2500 (1) For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or refer to our web site at www.ti.com. DAC8814 UNIT VDD to GND -0.3 to +8 V VSS to GND -0.3 to -7 V VREF to GND -18 to +18 V Logic inputs and output to GND -0.3 to + 8 V V(IOUT) to GND -0.3 to VDD + 0.3 V AGNDX to DGND -0.3 to +0.3 V Input current to any pin except supplies ±50 mA Package power dissipation (TJmax - TA)/θJA Thermal resistance, θ JA 28-Lead shrink surface-mount (RS-28) 100 °C/W Maximum junction temperature (TJmax) 150 °C Operating temperature range, Model A -40 to +85 °C Storage temperature range -65 to + 150 °C Lead temperature RS-28 (Vapor phase 60s) 215 °C RS-28 (Infrared 15s) 220 °C (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2 |
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