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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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HCPL-314J-500 Datenblatt(PDF) 5 Page - Agilent(Hewlett-Packard) |
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HCPL-314J-500 Datenblatt(HTML) 5 Page - Agilent(Hewlett-Packard) |
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5 / 16 page  5 Insulation and Safety Related Specifications Parameter Symbol HCPL-314J Units Conditions Minimum External Air Gap L(101) 8.3 mm Measured from input terminals (Clearance) to output terminals, shortest distance through air. Minimum External Tracking L(102) 8.3 mm Measured from input terminals (Creepage) to output terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.5 mm Through insulation distance (Internal Clearance) conductor to conductor, usually the straight line distance thickness between the emitter and detector. Tracking Resistance CTI >175 V DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Recommended Operating Conditions Parameter Symbol Min. Max. Units Note Power Supply VCC -VEE 10 30 V Input Current (ON) IF(ON) 812 mA Input Voltage (OFF) VF(OFF) -3.0 0.8 V Operating Temperature TA - 40 100 °C Absolute Maximum Ratings Parameter Symbol Min. Max. Units Note Storage Temperature TS -55 125 °C Operating Temperature TA -40 100 °C Average Input Current IF(AVG) 25 mA 1 Peak Transient Input Current (<1 µs pulse IF(TRAN) 1.0 A width, 300pps) Reverse Input Voltage VR 3V “High” Peak Output Current IOH(PEAK) 0.6 A 2 “Low” Peak Output Current IOL(PEAK) 0.6 A 2 Supply Voltage VCC-VEE -0.5 35 V Output Voltage VO(PEAK) -0.5 VCC V Output Power Dissipation PO 260 mW 3 Input Power Dissipation PI 105 mW 4 Lead Solder Temperature 260 °C for 10 sec., 1.6 mm below seating plane Solder Reflow Temperature Profile See Package Outline Drawings section |
Ähnliche Teilenummer - HCPL-314J-500 |
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Ähnliche Beschreibung - HCPL-314J-500 |
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