Datenblatt-Suchmaschine für elektronische Bauteile |
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CDACV10M7GA069-R0 Datenblatt(PDF) 11 Page - Murata Manufacturing Co., Ltd. |
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CDACV10M7GA069-R0 Datenblatt(HTML) 11 Page - Murata Manufacturing Co., Ltd. |
11 / 57 page Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested to approve our product specification or to transact the approval sheet for product specification, before your ordering. P61E7.pdf 01.10.17 Chip CERAFILr SFECS Series Notice 10 2 s Notice (Soldering and Mounting) 1. Standard Reflow Soldering Condition (1) Reflow The component cannot be withstand washing. 2. Wash Filter shall be soldered at 280 ±5˚C for 3.0±0.5 seconds. The soldering iron shall not touch the filter white soldering. (2) Soldering Iron 100 200 240 30 sec. min. 30 sec. max. Peak (240˚C max.) Pre-heating (120-170˚C) Heating (200˚C) Gradual Cooling 120 sec. min. 60-120 sec. s Notice (Handling) 1. The component will be damaged when an excessive stress is applied. 2. The component may be damaged if excess mechanical stress is applied to it mounted on the printed circuit board. 3. Design layout of components on the PC board to minimize the stress imposed on the warp or flexure of the board. 4. After installing chips, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to lower. To prevent this, be extremly careful in determining shape and dimension before designing the circuit board diagram. 5. When the positioning claws and pick up nozzle are worn, the load is applied to the chip while positioning is concentrated to one positioning accuracy, etc. Careful checking and maintenance are necessary to prevent unexpected trouble. 6. When correcting chips with a soldering iron, the tip of the soldering iron should not directly touch the chip component. Depending on the soldering conditions, the effective area of terminations may be reduced. The use of solder containing Ag should be done to prevent the electrode erosion. 7. Do not clean or wash the component as it is not hermetically sealed. 8. In case of covering filter with over coat, conditions such as material of resin, cure temperature, and so on should be evaluated well. 9. Do not use strong acidity flux, more than 0.2wt% chlorine content, in re-flow soldering. 10. Accurate test circuit values are required to measure electrical characteristics. It may be a cause of mis-correlation if there is any deviation, especially stray capacitance, from the test circuit in the specification. [Component layout close to board] Susceptibility to stress is in the order of : A>C>B B A C Slit Perforation |
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