4

Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(IO1)

7.1

mm

Measured from input terminals to output

(External Clearance)

terminals, shortest distance through air

Min. External Tracking Path

L(IO2)

7.4

mm

Measured from input terminals to output

(External Creepage)

terminals, shortest distance path along body

Min. Internal Plastic Gap

0.08

mm

Through insulation distance, conductor to

(Internal Clearance)

conductor, usually the direct distance

between the photoemitter and photodetector

inside the optocoupler cavity

Tracking Resistance

CTI

200

Volts

DIN IEC 112/VDE 0303 PART 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 – surface mount classification is Class A in accordance with CECC 00802.

Regulatory Information

The HCPL-2300 has been

approved by the following

organizations:

UL

Recognized under UL 1577,

Component Recognition Program,

File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA 88324.

Solder Reflow Temperature Profile

Recommended Pb-Free IR Profile

IEC/EN/DIN EN 60747-5-2

Approved under:

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884

Teil 2):2003-01

(Option 060 only)

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

217 °C

RAMP-DOWN

6 °C/SEC. MAX.

RAMP-UP

3 °C/SEC. MAX.

150 - 200 °C

260 +0/-5 °C

t 25 °C to PEAK

60 to 150 SEC.

20-40 SEC.

TIME WITHIN 5 °C of ACTUAL

PEAK TEMPERATURE

PREHEAT

60 to 180 SEC.

25

TIME

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.