Datenblatt-Suchmaschine für elektronische Bauteile |
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HCPL-8100 Datenblatt(PDF) 4 Page - Agilent(Hewlett-Packard) |
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HCPL-8100 Datenblatt(HTML) 4 Page - Agilent(Hewlett-Packard) |
4 / 11 page 4 Parameter Symbol Min. Max. Unit Storage Temperature TS −55 125 °C Ambient Operating Temperature TA −40 85 °C Junction Temperature TJ 150 °C Supply Voltage VCC −0.5 5.5 Volts Output Voltage VO −0.5 VCC Volts Tx-in Voltage VTx-in −0.5 VCC Volts Tx-en Voltage VTx-en −0.5 VCC Volts Solder Reflow Temperature Profile (See Solder Reflow Temperature Profile Section) Recommended Operating Conditions Absolute Maximum Ratings Solder Reflow Temperature Profile 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160 °C 140 °C 150 °C PEAK TEMP. 245 °C PEAK TEMP. 240 °C PEAK TEMP. 230 °C SOLDERING TIME 200 °C PREHEATING TIME 150 °C, 90 + 30 SEC. 2.5 °C ±0.5°C/SEC. 3 °C + 1°C/-0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3 °C + 1°C/- 0.5°C/SEC. REFLOW HEATING RATE 2.5 °C ±0.5°C/SEC. Parameter Symbol Min. Typ. Max. Unit Ambient Operating Temperature TA −40 25 85 °C Supply Voltage VCC 4.75 5 5.25 V |
Ähnliche Teilenummer - HCPL-8100 |
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Ähnliche Beschreibung - HCPL-8100 |
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