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MC33064D-5R2 Datenblatt(Datasheet) 11 Page - ON Semiconductor

Teile-Nr. MC33064D-5R2
Beschreibung  UNDERVOLTAGE SENSING CIRCUIT
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Hersteller  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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MC34064, MC33064, NCV33064
http://onsemi.com
11
PACKAGE DIMENSIONS
S
B
M
0.08 (0.003)
A S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
2.90
3.10
0.114
0.122
B
2.90
3.10
0.114
0.122
C
−−−
1.10
−−−
0.043
D
0.25
0.40
0.010
0.016
G
0.65 BSC
0.026 BSC
H
0.05
0.15
0.002
0.006
J
0.13
0.23
0.005
0.009
K
4.75
5.05
0.187
0.199
L
0.40
0.70
0.016
0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
−B−
−A−
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
−T−
SEATING
PLANE
C
H
J
L
DM SUFFIX
PLASTIC PACKAGE
CASE 846A−02
(Micro8)
ISSUE F
8X
8X
6X
mm
inches
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*




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