Datenblatt-Suchmaschine für elektronische Bauteile |
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FDN304PZ Datenblatt(PDF) 2 Page - Fairchild Semiconductor |
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FDN304PZ Datenblatt(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page FDN304PZ Rev C (W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –20 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C –13 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = –16 V, VGS = 0 V –1 µA IGSS Gate–Body Leakage VGS = ±8 V, V DS = 0 V ±10 uA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –0.4 –0.8 –1.5 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C 3 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = –4.5 V, ID = –2.4 A VGS = –2.5 V, ID = –2.0 A VGS = –1.8V, ID = –1.8 A 36 47 65 52 70 100 m Ω ID(on) On–State Drain Current VGS = –4.5 V, VDS = –5 V –10 A gFS Forward Transconductance VDS = –5 V, ID = –1.25 A 12 S Dynamic Characteristics Ciss Input Capacitance 1310 pF Coss Output Capacitance 240 pF Crss Reverse Transfer Capacitance VDS = –10 V, V GS = 0 V, f = 1.0 MHz 106 pF RG Gate Resistance VGS = 15 mV, f = 1.0 MHz 5.6 Ω Switching Characteristics (Note 2) td(on) Turn–On Delay Time 15 27 ns tr Turn–On Rise Time 15 27 ns td(off) Turn–Off Delay Time 40 64 ns tf Turn–Off Fall Time VDD = –10 V, ID = –1 A, VGS = –4.5 V, RGEN = 6 Ω 25 40 ns Qg Total Gate Charge 12 20 nC Qgs Gate–Source Charge 2 nC Qgd Gate–Drain Charge VDS = –10 V, ID = –2.4 A, VGS = –4.5 V 2 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current –0.42 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = –0.42 (Note 2) –0.6 –1.2 V trr Reverse Recovery Time 18 ns Qrr Reverse Recovery Charge IF = –2.4 A, diF/dt = 100 A/µs 7 nC Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 250 °C/W when mounted on a 0.02 in2 pad of 2 oz. copper. b) 270°C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0% |
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