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ISO6741 Datenblatt(PDF) 4 Page - Texas Instruments |
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ISO6741 Datenblatt(HTML) 4 Page - Texas Instruments |
4 / 35 page 6 Specifications 6.1 Absolute Maximum Ratings See(1) MIN MAX UNIT Supply voltage (2) VCC1, VCC2 -0.5 6 V Voltage at INx, OUTx, ENx V -0.5 VCCX + 0.5 (3) V Output current Io -15 15 mA Temperature Operating junction temperature, TJ 150 °C Storage temperature, Tstg -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values (3) Maximum voltage must not exceed 6 V. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ ESDA/JEDEC JS-001, all pins(1) ±6000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1500 Contact discharge per IEC 61000-4-2; Isolation barrier withstand test(3) (4) ±8000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. (3) IEC ESD strike is applied across the barrier with all pins on each side tied together creating a two-terminal device. (4) Testing is carried out in air or oil to determine the intrinsic contact discharge capability of the device. ISO6741 SLLSFJ6 – AUGUST 2020 www.ti.com 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: ISO6741 |
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