Datenblatt-Suchmaschine für elektronische Bauteile |
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OPA862 Datenblatt(PDF) 28 Page - Texas Instruments |
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OPA862 Datenblatt(HTML) 28 Page - Texas Instruments |
28 / 37 page 10.2 Layout Examples A1 + ± A2 + ± 700 700 1 8 5 VS± VS+ R REF 2 3 OPA862 R INT R INT R F R G R OP 4 R ON C BYP C BYP 6 7 PD V IN Figure 10-1. Representative Schematic for Layout in Place output resistors close to output pins to minimize parasitic capacitance Ground and power plane removed from inner layers. Ground fill on outer layers also removed Ground and power plane exist on inner layers. Place bypass capacitors close to power pins Remove GND and Power plane under output and inverting pins to minimize stray PCB capacitance CBYP RG 1 8 2 7 3 6 4 5 RF ROP RON Vias to connect RREF and CBYP. Place these components on the other side of the PCB close to the vias. VIN RREF and CBYP not shown as they are on the other side of the PCB. Figure 10-2. Layout Recommendations OPA862 SBOS919C – AUGUST 2019 – REVISED AUGUST 2020 www.ti.com 28 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: OPA862 |
Ähnliche Teilenummer - OPA862_V02 |
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Ähnliche Beschreibung - OPA862_V02 |
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