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KM416S1021CT-G8 Datenblatt(PDF) 4 Page - Samsung semiconductor

Teilenummer KM416S1021CT-G8
Bauteilbeschribung  512K x 16Bit x 2 Banks Synchronous DRAM with SSTL interface
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Hersteller  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

KM416S1021CT-G8 Datenblatt(HTML) 4 Page - Samsung semiconductor

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KM416S1021C
REV. 1. May '98
CMOS SDRAM
Preliminary
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70
°C)
Parameter
Symbol
Test Condition
CAS
Latency
Version
Unit
Note
-7
-S
-8
Operating current
(One bank active)
ICC1
Burst length = 1
tRC
≥ tRC(min)
IOL = 0 mA
95
90
95
mA
1
Precharge standby current in
power-down mode
ICC2P
CKE
≤ VIL(max), tCC = 15ns
2
mA
ICC2PS
CKE & CLK
≤ VIL(max), tCC = ∞
2
Precharge standby current in
non power-down mode
ICC2N
CKE
≥ VIH(min), CS ≥ VIH(min), tCC = 15ns
Input signals are changed one time during 30ns
20
mA
ICC2NS
CKE
≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
6
Active standby current in
power-down mode
ICC3P
CKE
≤ VIL(max), tCC = 15ns
3
mA
ICC3PS
CKE & CLK
≤ VIL(max), tCC = ∞
2
Active Standby current in
non power-down mode
(One bank active)
ICC3N
CKE
≥ VIH(min), CS ≥ VIH(min), tCC = 15ns
Input signals are changed one time during 30ns
30
mA
ICC3NS
CKE
≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
20
mA
Operating current
(Burst mode)
ICC4
IOL = 0 mA
Page burst
tCCD = 2CLKs
3
150
140
130
mA
1
2
105
100
100
Refresh current
ICC5
tRC
≥ tRC(min)
90
85
80
mA
2
Self refresh current
ICC6
CKE
≤ VIL(max)
2
mA
3
1. Measured with outputs open.
2. Refresh period is 64ms.
Notes :


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